01
Operando optical measurement
Track optical response across the substrate while potential and current are controlled, retaining the time and spatial information lost in a single electrode-wide signal.
Semiconductor process metrology
See electrodeposition as it happens.
FabSight is developing operando optical metrology and analysis software for semiconductor electrodeposition, starting with copper feature filling on patterned wafers.
Optical response
Electrochemical sync
Bulk signals can hide local failure.
Feature geometry, additives, transport and surface evolution interact during plating. FabSight is being built to reveal where those differences emerge across a patterned surface, before the final deposit is all you can measure.
Technology
A measurement platform built around the deposition process.
FabSight combines synchronized optical imaging, electrochemical control and spatial analysis to turn patterned substrates into information-rich process experiments.
02
Synchronized electrochemistry
Link image sequences to potential, current, waveform and process conditions so optical transitions can be interpreted against the electrochemical experiment.
03
Spatial process analytics
Compare regions and feature populations, identify reproducible response classes and connect early process behavior to later filling and morphology.
The FabSight workflow
From process condition to spatial process insight.
The initial platform is designed for process development rather than production-line deployment. It is intended to help teams compare chemistries, process windows and patterned test structures with a measurement that evolves with the deposition itself.
- 1RunControlled plating experiment
- 2ObserveSynchronized optical + electrochemical data
- 3CompareRegions, patterns and process conditions
- 4ValidateConnect signals to deposit outcomes
Applications
Designed for the questions process-development teams actually ask.
FabSight's first development focus is copper electrodeposition, with a platform architecture intended to extend to other metals and geometries as the measurement is validated.
Damascene process development
Compare how additive chemistry and process conditions affect patterned feature populations during copper growth.
TSV & advanced packaging plating
Evaluate spatial differences across larger recessed structures where geometry and transport can strongly influence filling behavior.
Plating chemistry development
Generate time-resolved, spatial evidence for how suppressors, accelerators, levelers and other bath variables alter the deposition response.
Current stage
Building the first company-owned platform.
FabSight is at an early development stage. The current program is focused on building and validating an Alpha-1 instrument, separating useful interfacial and growth information from thickness and roughness effects, and testing reproducibility across patterned substrates.
NowPrototype design, optical/electrochemical integration and validation planning
NextControlled copper deposition studies and independent morphology validation
PartnerSeeking semiconductor process-development and chemistry-development conversations
Company
Electrochemistry, optics and data analysis in one development platform.
FabSight is an Oregon-based semiconductor metrology startup developing tools for observing and understanding electrodeposition on patterned substrates. The company is being built around a simple premise: process development is more informative when the measurement can resolve where and when differences emerge.
GH
Founder & Technical Lead
Gary S. Harlow, Ph.D.
Electrochemist and surface-science researcher working at the intersection of electrochemical interfaces, operando optical measurements and semiconductor electrodeposition.
Work with FabSight
Interested in electrodeposition metrology?
We're interested in conversations with semiconductor process-development teams, plating-chemistry suppliers, equipment developers and early technical partners.